backgrind
SayBAK-grynd/ˈbækˌɡɹaɪnd/
- 1To thin a semiconductor wafer by grinding material away from its back side during chip manufacture.
Technicians backgrind each wafer until only a thin layer of silicon remains.
The fab backgrinds thousands of wafers daily to meet its packaging targets.
Note
A compound of back- and grind that keeps its parent's irregular past: yesterday's wafers were background, not backgrinded. That past form is spelled exactly like the everyday noun background, so in process notes "the background wafers" means wafers already thinned, not anything in the scenery. The grinding follows completion of the front-side circuitry and readies the wafer for dicing and packaging.
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Origin
Formed from the prefix "back-" combined with "grind."